Printed antenna and chip interconnection, due to the high operating frequency of the RFID tags, tiny chips thin, the current mainstream method is divided into two types:

The most suitable method is flip-chip (Flip Chip) technology, which provides high performance, low cost, miniaturization, high reliability, to meet the flexible substrate materials, flip bonding material to a conductive adhesive to achieve chip and antenna pad interconnect. Flexible substrate to achieve high-volume low-cost production, and in order to more effectively reduce the cost of production, a new approach for interconnection of the antenna and the chip is currently the hot issues of international and domestic research.

In order to adapt to the smaller size of the RFID chip, effectively reduce production costs, the use of chip and antenna substrate bonding package is divided into two templates are complete current trend. One specific approach is: the large size of the antenna substrate and connected to the small chip substrates were manufactured after the completion of chip placement and interconnections on a small base, and then with large Tianxin complete circuit board guide through the large pad adhesion through. Similar to the above two methods packaging process template is to be transferred to the chip can carry equally spaced chip carrier tape, then tape carrier substrate flip chip attached to an antenna. In this method, the flip-chip is by carrying rolled way to achieve, simplifying the chip pickup operation, which can achieve higher productivity.

Another method is to wire bonding (wire bonding) which is a semiconductor chip pad and electronic packaging shell I / O leads or pads on the wiring substrate technology with metal filaments connecting technology. Has developed a variety of automatic machine suitable for mass production, bonding parameters can be precisely controlled, a time loop wire interconnection of two joint formation process requires only 100ms-125ms, the pitch has been reached 50μM. Wire bonding technique is a method of interconnecting the first semiconductor device used. Although flip chip bump interconnect applications is growing, but still achieve wire bonding an integrated circuit chip and package a variety of housing is electrically connected to the most common and also the most simple and effective way.